Ansys Icepak

About Ansys Icepak

Ansys Icepak is a CFD solution for heat control in electronics that forecasts heat transfer, temperature and airflow in power electronics, IC packages, electronic assemblies/enclosures, and PCBs. It offers sophisticated electronic cooling solutions that use the industry-leading Ansys Fluent CFD (computational fluid dynamics) solver for fluid flow and thermal studies of electronic assemblies, integrated circuits (ICs), PCBs (printed circuit boards) and packages. You can perform radiation, convection, and conduction conjugate heat transfer studies, as well as species analysis and laminar and turbulent flow modelling, including convection and radiation with Ansys. You can also gain embedded Joule heating analysis that allows you to solve closely linked electrical and thermal domains at the same time. Electrical voltage and current excitations, as well as thermal sources and loads, can all be included. Users get a basic toolkit for setting up and running parametric runs for training design points in the new LPV ROM (Linear Parameter Varying Reduced-Order Model) functionality with Ansys. Solver initialization, meshing and MCAD geometry loading are 10 to 100 times quicker with Ansys Icepak solver and performance enhancements.